Three Main Technologic Potentials of COB Packaging Technology
52 Views 0 February 11, 2020 February 12, 2020 jon
- High Reliability The pixel failure rate index at the panel level can be increased by two orders of magnitude, from 10,000 levels to one million levels. The hardware protection ability of the LED lamp can reach the commercial or even civilian level, which can effectively protect against bumps during the installation and handling of the screen.
- Low Cost After industrialization, the hard cost of COB integrated package lamp is lower than traditional technology.
- Can achieve smaller pixel pitch Future COB integrated packaging technology can make the pixel pitch exceed 0.5mm, and has stable production and use performance.